Product Name:Modified polyphenylene ether
Purity:98.5%
Appearance:White Powder
Sample:Available
Storage:Cool and ventilated place
CAS No.: 25667-40-7
Modified Polyphenylene Ether Cas 25667-40-7
Typical Properties
Chemical Name:Modified polyphenylene ether
Cas No:25667-40-7
Synonyms:Poly(oxy-1,4-phenylene)
Molecular Formula:(C6H4O)n
Molecular Structure:
| Item | Specification |
| Melting Point | 290 °C |
| Density | 1.27 g/cm3 |
| Fp | 280°C |
| refractive index | 1.585-1.595 |
| Gravity | 1.02 g/m³ |
| Hydroxy Equivalent Weight | 840 g/mol |
| Mn | 1600 |
| Phenolic End-group Content | 2 % |
| Toluene : 21°C | 50.0 wt% |
| Methyl Ethyl Ketone : 21°C | 50.0 wt% |
| Water content | ≤0.1% |
| Ash content | ≤0.1% |
| Insoluble matter | ≤0.1% |
Usage
Printed Circuit Boards (PCBs) and Copper Clad Laminates: Used as reactive modifiers in epoxy and cyanate ester thermoset systems to improve dielectric properties, heat resistance, and flame retardancy.
Encapsulation and Prepregs: Used in semiconductor encapsulation adhesives and epoxy prepregs to enhance bonding strength and reflow soldering resistance.
High-Performance Composite Matrices: Combined with epoxy resins and carbon fiber/glass fiber composites to manufacture structural components for aerospace and rail transportation, improving modulus, heat resistance, and chemical resistance while reducing weight.
Adhesives and Sealants: Used as toughening modifiers for epoxy adhesives to improve peel strength and resistance to humid heat aging, for bonding electronic components, metal-composite structural bonding, and aerospace component sealing.
Industrial Anti-Corrosion Coatings: Used as temperature-resistant anti-corrosion primers for chemical equipment and offshore platforms.
Packaging and Shipping
25kg/drum
According to customer requirements.
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Modified Polyphenylene Ether Cas 25667-40-7